A new active solder for joining electronic components
Conference
·
OSTI ID:756107
Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 756107
- Report Number(s):
- SAND2000-1191C; TRN: AH200021%%127
- Resource Relation:
- Conference: International Brazing and Soldering Conference, Albuquerque, NM (US), 04/02/2000--04/05/2000; Other Information: PBD: 11 May 2000
- Country of Publication:
- United States
- Language:
- English
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