Metal-ceramic joining; Proceedings of the Symposium, TMS Fall Meeting, Detroit, MI, Oct. 8, 9, 1990
- Cabot Corp., Boyertown, PA (United States) Rutgers University, Piscataway, NJ (United States)
Topics discussed in this book are in the areas of high temperature applications, joining processes, and electronic applications in metal ceramic joining. Papers are presented on the reactive diffusion bonding of Si3N4 to MA6000, the material factors affecting joining of silicon nitride ceramics, an overview of techniques and recent advances in ceramic-metal joining and metallization, a residual stress analysis and microstructural observations of ceramic-to-metal brazed joints, and the peel adhesion bond strength of direct bonded copper-alumina as affected by alumina sintering aids. Attention is also given to joining of partially stabilized zirconia to nodular cast iron, the silicate brazing of alumina ceramics using calcium aluminosilicate interlayers, graded metal-ceramic microjoints in parallel, the reactive metal brazing of aluminum nitride, and the effect of substrate surface on the bonding of Cu-AlN by active metal thin film and gas-metal eutectic methods.
- OSTI ID:
- 6907277
- Report Number(s):
- CONF-901008--; ISBN: 0-87339-128-4
- Country of Publication:
- United States
- Language:
- English
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ABSTRACTS
CALCULATION METHODS
CERAMICS
CERMETS
CHALCOGENIDES
COMPOSITE MATERIALS
CREEP
DIFFUSION WELDING
DOCUMENT TYPES
ELEMENTS
FABRICATION
FINITE ELEMENT METHOD
FRACTURE MECHANICS
JOINING
LEADING ABSTRACT
MATERIALS
MECHANICAL PROPERTIES
MECHANICS
MEETINGS
METALS
NITRIDES
NITROGEN COMPOUNDS
NUMERICAL SOLUTION
OXIDES
OXYGEN COMPOUNDS
PNICTIDES
RESIDUAL STRESSES
SILICON COMPOUNDS
SILICON NITRIDES
STRESS ANALYSIS
STRESSES
TRANSITION ELEMENT COMPOUNDS
WELDING
ZIRCONIUM COMPOUNDS
ZIRCONIUM OXIDES