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U.S. Department of Energy
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Metal-ceramic joining; Proceedings of the Symposium, TMS Fall Meeting, Detroit, MI, Oct. 8, 9, 1990

Conference ·
OSTI ID:6907277
;  [1]
  1. Cabot Corp., Boyertown, PA (United States) Rutgers University, Piscataway, NJ (United States)

Topics discussed in this book are in the areas of high temperature applications, joining processes, and electronic applications in metal ceramic joining. Papers are presented on the reactive diffusion bonding of Si3N4 to MA6000, the material factors affecting joining of silicon nitride ceramics, an overview of techniques and recent advances in ceramic-metal joining and metallization, a residual stress analysis and microstructural observations of ceramic-to-metal brazed joints, and the peel adhesion bond strength of direct bonded copper-alumina as affected by alumina sintering aids. Attention is also given to joining of partially stabilized zirconia to nodular cast iron, the silicate brazing of alumina ceramics using calcium aluminosilicate interlayers, graded metal-ceramic microjoints in parallel, the reactive metal brazing of aluminum nitride, and the effect of substrate surface on the bonding of Cu-AlN by active metal thin film and gas-metal eutectic methods.

OSTI ID:
6907277
Report Number(s):
CONF-901008--; ISBN: 0-87339-128-4
Country of Publication:
United States
Language:
English