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Title: Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

Patent ·
OSTI ID:1531819
; ;

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Research Organization:
Cree Fayetteville, Inc., Fayetteville, AR (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0006429; SC0008239
Assignee:
Cree Fayetteville, Inc. (Fayetteville, AR)
Patent Number(s):
10,076,800
Application Number:
14/954,243
OSTI ID:
1531819
Resource Relation:
Patent File Date: 2015-11-30
Country of Publication:
United States
Language:
English

References (26)

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