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Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks

Patent ·
OSTI ID:1860142
; ; ;
Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.
Research Organization:
University of Chicago, IL (United States)
Sponsoring Organization:
USDOE; National Science Foundation (NSF)
DOE Contract Number:
SC0011262; SC0015267
Assignee:
The University of Chicago (Chicago, IL)
Patent Number(s):
11,194,059
Application Number:
16/842,261
OSTI ID:
1860142
Country of Publication:
United States
Language:
English

References (1)

A Brief Technical History of the Large-Area Picosecond Photodetector (LAPPD) Collaboration preprint January 2016

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