Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks
Patent
·
OSTI ID:1860142
Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.
- Research Organization:
- University of Chicago, IL (United States)
- Sponsoring Organization:
- USDOE; National Science Foundation (NSF)
- DOE Contract Number:
- PHY1066014; SC0011262; SC0015267
- Assignee:
- The University of Chicago (Chicago, IL)
- Patent Number(s):
- 11,194,059
- Application Number:
- 16/842,261
- OSTI ID:
- 1860142
- Resource Relation:
- Patent File Date: 04/07/2020
- Country of Publication:
- United States
- Language:
- English
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