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Title: Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks

Patent ·
OSTI ID:1860142

Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.

Research Organization:
University of Chicago, IL (United States)
Sponsoring Organization:
USDOE; National Science Foundation (NSF)
DOE Contract Number:
PHY1066014; SC0011262; SC0015267
Assignee:
The University of Chicago (Chicago, IL)
Patent Number(s):
11,194,059
Application Number:
16/842,261
OSTI ID:
1860142
Resource Relation:
Patent File Date: 04/07/2020
Country of Publication:
United States
Language:
English

References (17)

Metallic solder composite bonding patent September 1982
Waterproof Structure for Electronic Device patent-application March 2012
Use of Flat Panel Microchannel Photomultipliers in Sampling Calorimeters with Timing patent-application April 2016
Waterproof structure patent August 2016
Display Apparatus patent-application June 2015
Case Assembly Structure of Electronic Device patent-application November 2008
Low temperature hermetic sealing method having passivation layer patent-application June 2003
Waterproof Case for Electrical Apparatus patent-application June 2010
A Brief Technical History of the Large-Area Picosecond Photodetector (LAPPD) Collaboration preprint January 2016
Electronic control apparatus for vehicle patent August 2017
Casing with channel discontinuity that resists capillary action patent April 2013
Batch Production of Microchannel Plate Photo-Multipliers patent-application September 2017
Housing seal interface patent April 1993
Electrically insulating seal assembly patent June 1982
Soldering Method, Gyroscope and Soldered Part patent-application September 2012
Housing and methods of producing a housing patent December 2003
Housing for electrical operating means patent April 2015

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