Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly
Patent
·
OSTI ID:1859909
A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.
- Research Organization:
- Cree, Inc., Durham, NC (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0006429; SC0008239
- Assignee:
- Cree, Inc. (Durham, NC)
- Patent Number(s):
- 11,135,669
- Application Number:
- 16/133,411
- OSTI ID:
- 1859909
- Country of Publication:
- United States
- Language:
- English
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