Device-packaging method and apparatus for optoelectronic circuits
An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation
- Patent Number(s):
- 9,632,261
- Application Number:
- 14/819,293
- OSTI ID:
- 1353067
- Resource Relation:
- Patent File Date: 2015 Aug 05
- Country of Publication:
- United States
- Language:
- English
Similar Records
Challenges in the Packaging of MEMS
Processing issues and technologies for optoelectronics-integrated circuits and devices