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Title: Device-packaging method and apparatus for optoelectronic circuits

Patent ·
OSTI ID:1353067

An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation
Patent Number(s):
9,632,261
Application Number:
14/819,293
OSTI ID:
1353067
Resource Relation:
Patent File Date: 2015 Aug 05
Country of Publication:
United States
Language:
English

References (10)

Lid wafer bond packaging and micromachining patent June 1999
Optical device module patent December 2002
Opto-electronic transceiver module and hermetically sealed housing therefore patent January 2003
Opto-electronic substrates with electrical and optical interconnections and methods for making patent August 2003
Chip-to-chip optical interconnect patent May 2008
Optical module package and optical module patent June 2009
System and method for the fabrication of an electro-optical module patent February 2010
Optical connectors and a method of production thereof patent November 2014
Layer separation optimization in CMOS compatible multilayer optical networks conference May 2013
Wafer-Level Packaging Technology for 10 Gbps TOSAs conference May 2005

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