Sealed substrate carrier for electroplating
Patent
·
OSTI ID:1068864
- Fremont, CA
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
- Research Organization:
- SunPower Corporation (San Jose, CA)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC36-07GO17043
- Assignee:
- SunPower Corporation (San Jose, CA)
- Patent Number(s):
- 8,221,600
- Application Number:
- 12/889,228
- OSTI ID:
- 1068864
- Country of Publication:
- United States
- Language:
- English
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