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Title: Non-permeable substrate carrier for electroplating

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Inventors:
; ; ;
Publication Date:
Research Org.:
SunPower Corporation (San Jose, CA)
Sponsoring Org.:
USDOE
OSTI Identifier:
1080303
Patent Number(s):
8,317,987
Application Number:
12/889,219
Assignee:
SunPower Corporation (San Jose, CA) GFO
DOE Contract Number:  
FC36-07GO17043
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, and Ganti, Kalyana Bhargava. Non-permeable substrate carrier for electroplating. United States: N. p., 2012. Web.
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, & Ganti, Kalyana Bhargava. Non-permeable substrate carrier for electroplating. United States.
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, and Ganti, Kalyana Bhargava. Tue . "Non-permeable substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1080303.
@article{osti_1080303,
title = {Non-permeable substrate carrier for electroplating},
author = {Abas, Emmanuel Chua and Chen, Chen-An and Ma, Diana Xiaobing and Ganti, Kalyana Bhargava},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 27 00:00:00 EST 2012},
month = {Tue Nov 27 00:00:00 EST 2012}
}

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