skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Non-permeable substrate carrier for electroplating

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Inventors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
SunPower Corporation, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1234229
Patent Number(s):
9,222,193
Application Number:
13/661,966
Assignee:
SunPower Corporation GFO
DOE Contract Number:
FC36-07GO17043
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Oct 26
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE

Citation Formats

Abas, Emmanuel Chua, Chen, Chen-an, Ma, Diana Xiaobing, Ganti, Kalyana, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., and Castillo, Arnold Villamor. Non-permeable substrate carrier for electroplating. United States: N. p., 2015. Web.
Abas, Emmanuel Chua, Chen, Chen-an, Ma, Diana Xiaobing, Ganti, Kalyana, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., & Castillo, Arnold Villamor. Non-permeable substrate carrier for electroplating. United States.
Abas, Emmanuel Chua, Chen, Chen-an, Ma, Diana Xiaobing, Ganti, Kalyana, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., and Castillo, Arnold Villamor. Tue . "Non-permeable substrate carrier for electroplating". United States. doi:. https://www.osti.gov/servlets/purl/1234229.
@article{osti_1234229,
title = {Non-permeable substrate carrier for electroplating},
author = {Abas, Emmanuel Chua and Chen, Chen-an and Ma, Diana Xiaobing and Ganti, Kalyana and Divino, Edmundo Anida and Ermita, Jake Randal G. and Capulong, Jose Francisco S. and Castillo, Arnold Villamor},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 29 00:00:00 EST 2015},
month = {Tue Dec 29 00:00:00 EST 2015}
}

Patent:

Save / Share: