Silicon on insulator material technology
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journal
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January 1995 |
Solid‐state reaction‐mediated low‐temperature bonding of GaAs and InP wafers to Si substrates
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journal
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February 1994 |
Ge Layer Transfer To Si For Photovoltaic Applications
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journal
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January 2001 |
Electrical and Structural Characterization of the Interface of Wafer Bonded InP/Si
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journal
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January 2003 |
Electron and hole mobility enhancement in strained SOI by wafer bonding
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journal
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September 2002 |
InGaAs/InP double heterostructures on InP/Si templates fabricated by wafer bonding and hydrogen-induced exfoliation
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journal
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December 2003 |
Wafer bonding and layer transfer processes for 4-junction high efficiency solar cells
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conference
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January 2002 |
Controlled surface nanopatterning with buried dislocation arrays
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journal
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November 2003 |
Fundamental issues in wafer bonding
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journal
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July 1999 |
III-V compounds for solar cell applications
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journal
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June 1999 |
Integration of Si and SiGe with Al2O3 (sapphire)
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journal
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November 2001 |
Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding *1
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journal
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March 1997 |
Wafer Bonding and Layer Splitting for Microsystems
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journal
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December 1999 |
Germanium-on-insulator substrates by wafer bonding
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journal
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August 2004 |
Heterogeneous silicon integration by ultra-high vacuum wafer bonding
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journal
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August 2003 |
Strained Si, SiGe, and Ge on-insulator: review of wafer bonding fabrication techniques
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journal
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August 2004 |
Publisher's Note: Donor level of bond-center hydrogen in germanium [Phys. Rev. B 69 , 245207 (2004)]
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journal
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August 2004 |
Wafer-scale integration of GaAs optoelectronic devices with standard Si integrated circuits using a low-temperature bonding procedure
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journal
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December 2002 |
Wafer bonding of silicon wafers covered with various surface layers
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journal
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October 2000 |
Strained Si on insulator technology: from materials to devices
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journal
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August 2004 |
A “smarter-cut” approach to low temperature silicon layer transfer
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journal
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January 1998 |
Wafer bonding of different III–V compound semiconductors by atomic hydrogen surface cleaning
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journal
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October 2001 |
Hydrophobic silicon wafer bonding
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journal
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January 1994 |
Semiconductor Wafer Bonding
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journal
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August 1998 |
Multi-junction solar cells and novel structures for solar cell applications
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journal
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April 2002 |
Layer splitting process in hydrogen-implanted Si, Ge, SiC, and diamond substrates
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journal
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March 1997 |
Electron mobility enhancement in strained-Si n-MOSFETs fabricated on SiGe-on-insulator (SGOI) substrates
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journal
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July 2001 |
Smart-Cut® technology: from 300 mm ultrathin SOI production to advanced engineered substrates
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journal
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June 2004 |
SiGe-on-insulator prepared by wafer bonding and layer transfer for high-performance field-effect transistors
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journal
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February 2001 |
Ge layer transfer to Si for photovoltaic applications
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journal
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February 2002 |