Mathematics of Gas Ingress of Hermetic Packages
Abstract
Herein, we have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.
- Authors:
-
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security
- OSTI Identifier:
- 1765739
- Report Number(s):
- SAND-2020-4890J
Journal ID: ISSN 2156-3950; 685969
- Grant/Contract Number:
- AC04-94AL85000; NA0003525
- Resource Type:
- Accepted Manuscript
- Journal Name:
- IEEE Transactions on Components, Packaging, and Manufacturing Technology
- Additional Journal Information:
- Journal Volume: 10; Journal Issue: 12; Journal ID: ISSN 2156-3950
- Publisher:
- IEEE
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; Gas egress; gas ingress; hermetic; leak; multichip module; packages; reliability; packaging; microelectronics; helium; fluid flow; semiconductor devices
Citation Formats
Fang, Lu, and Menk, Lyle Alexander. Mathematics of Gas Ingress of Hermetic Packages. United States: N. p., 2020.
Web. doi:10.1109/tcpmt.2020.3037458.
Fang, Lu, & Menk, Lyle Alexander. Mathematics of Gas Ingress of Hermetic Packages. United States. https://doi.org/10.1109/tcpmt.2020.3037458
Fang, Lu, and Menk, Lyle Alexander. Wed .
"Mathematics of Gas Ingress of Hermetic Packages". United States. https://doi.org/10.1109/tcpmt.2020.3037458. https://www.osti.gov/servlets/purl/1765739.
@article{osti_1765739,
title = {Mathematics of Gas Ingress of Hermetic Packages},
author = {Fang, Lu and Menk, Lyle Alexander},
abstractNote = {Herein, we have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.},
doi = {10.1109/tcpmt.2020.3037458},
journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},
number = 12,
volume = 10,
place = {United States},
year = {Wed Nov 11 00:00:00 EST 2020},
month = {Wed Nov 11 00:00:00 EST 2020}
}
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