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Title: Practical issues and applications for vacuum and hermetic microsystems packaging.

Abstract

Microsystems packaging involves physically placing and electrically interconnecting a microelectronic device in a package that protects it from and interfaces it with the outside world. When the device requires a hermetic or controlled microenvironment, it is typically sealed within a cavity in the package. Sealing involves placing and attaching a lid, typically by welding, brazing, or soldering. Materials selection (e.g., the epoxy die attach), and process control (e.g., the epoxy curing temperature and time) are critical for reproducible and reliable microsystems packaging. This paper will review some hermetic and controlled microenvironment packaging at Sandia Labs, and will discuss materials, processes, and equipment used to package environmentally sensitive microelectronics (e.g., MEMS and sensors).

Authors:
Publication Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1030387
Report Number(s):
SAND2010-7901C
TRN: US201124%%172
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the New Mexico Institute of Mining and Technology Class Seminar held November 17, 2010 in Socorro, NM.
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BRAZING; CURING; MICROELECTRONICS; PACKAGING; PROCESS CONTROL; SENSORS; SOLDERING; WELDING; MATERIALS

Citation Formats

Ewsuk, Kevin Gregory. Practical issues and applications for vacuum and hermetic microsystems packaging.. United States: N. p., 2010. Web.
Ewsuk, Kevin Gregory. Practical issues and applications for vacuum and hermetic microsystems packaging.. United States.
Ewsuk, Kevin Gregory. 2010. "Practical issues and applications for vacuum and hermetic microsystems packaging.". United States.
@article{osti_1030387,
title = {Practical issues and applications for vacuum and hermetic microsystems packaging.},
author = {Ewsuk, Kevin Gregory},
abstractNote = {Microsystems packaging involves physically placing and electrically interconnecting a microelectronic device in a package that protects it from and interfaces it with the outside world. When the device requires a hermetic or controlled microenvironment, it is typically sealed within a cavity in the package. Sealing involves placing and attaching a lid, typically by welding, brazing, or soldering. Materials selection (e.g., the epoxy die attach), and process control (e.g., the epoxy curing temperature and time) are critical for reproducible and reliable microsystems packaging. This paper will review some hermetic and controlled microenvironment packaging at Sandia Labs, and will discuss materials, processes, and equipment used to package environmentally sensitive microelectronics (e.g., MEMS and sensors).},
doi = {},
url = {https://www.osti.gov/biblio/1030387}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2010},
month = {11}
}

Conference:
Other availability
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