skip to main content
DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices

Abstract

Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.

Authors:
 [1];  [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Department of Microsystems Integration
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security
OSTI Identifier:
1670730
Report Number(s):
SAND-2019-9202J
Journal ID: ISSN 2327-2503; 678243
Grant/Contract Number:  
AC04-94AL85000; NA0003525
Resource Type:
Accepted Manuscript
Journal Name:
Advances in Materials
Additional Journal Information:
Journal Volume: 8; Journal Issue: 4; Journal ID: ISSN 2327-2503
Country of Publication:
United States
Language:
English
Subject:
gas leak; ingress; egress; hermetic package; MEMS; MCM; reliability

Citation Formats

Fang, Lu, and Alexander Menk, Lyle. Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. United States: N. p., 2019. Web. https://doi.org/10.11648/j.am.20190804.17.
Fang, Lu, & Alexander Menk, Lyle. Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. United States. https://doi.org/10.11648/j.am.20190804.17
Fang, Lu, and Alexander Menk, Lyle. Fri . "Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices". United States. https://doi.org/10.11648/j.am.20190804.17. https://www.osti.gov/servlets/purl/1670730.
@article{osti_1670730,
title = {Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices},
author = {Fang, Lu and Alexander Menk, Lyle},
abstractNote = {Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.},
doi = {10.11648/j.am.20190804.17},
journal = {Advances in Materials},
number = 4,
volume = 8,
place = {United States},
year = {2019},
month = {12}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

Figure 1 Figure 1: MEMS MCM floor plan

Save / Share:
Figures/Tables have been extracted from DOE-funded journal article accepted manuscripts.