Mathematics of Gas Ingress of Hermetic Packages

Fang, Lu; Menk, Lyle Alexander

doi:10.1109/tcpmt.2020.3037458

Title: Mathematics of Gas Ingress of Hermetic Packages

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Abstract

Herein, we have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.

Authors:

^[1]; Menk, Lyle Alexander ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Publication Date:: Wed Nov 11 00:00:00 EST 2020

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:: USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security

OSTI Identifier:: 1765739

Report Number(s):: SAND-2020-4890J
Journal ID: ISSN 2156-3950; 685969

Grant/Contract Number:: AC04-94AL85000; NA0003525

Resource Type:: Accepted Manuscript

Journal Name:: IEEE Transactions on Components, Packaging, and Manufacturing Technology

Additional Journal Information:: Journal Volume: 10; Journal Issue: 12; Journal ID: ISSN 2156-3950

Publisher:: IEEE

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; Gas egress; gas ingress; hermetic; leak; multichip module; packages; reliability; packaging; microelectronics; helium; fluid flow; semiconductor devices

Citation Formats


                    Fang, Lu, and Menk, Lyle Alexander. Mathematics of Gas Ingress of Hermetic Packages.  United States: N. p., 2020. 
Web.  doi:10.1109/tcpmt.2020.3037458.

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                    Fang, Lu, & Menk, Lyle Alexander. Mathematics of Gas Ingress of Hermetic Packages.  United States.  https://doi.org/10.1109/tcpmt.2020.3037458

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                    Fang, Lu, and Menk, Lyle Alexander. Wed .  
"Mathematics of Gas Ingress of Hermetic Packages".  United States.  https://doi.org/10.1109/tcpmt.2020.3037458.  https://www.osti.gov/servlets/purl/1765739.

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@article{osti_1765739,

  title        = {Mathematics of Gas Ingress of Hermetic Packages},

  author       = {Fang, Lu and Menk, Lyle Alexander},

  abstractNote = {Herein, we have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.},

  doi          = {10.1109/tcpmt.2020.3037458},

  journal      = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},

  number       = 12,

  volume       = 10,

  place        = {United States},

  year         = {Wed Nov 11 00:00:00 EST 2020},

  month        = {Wed Nov 11 00:00:00 EST 2020}

}

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