Particle-free microchip processing
Abstract
Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.
- Inventors:
-
- 7723 Storrie Pl. NE., Albuquerque, NM 87109
- 7217 Ottawa Rd. NE., Albuquerque, NM 87109
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 870442
- Patent Number(s):
- 5522933
- Assignee:
- Geller, Anthony S. (7723 Storrie Pl. NE., Albuquerque, NM 87109);Rader, Daniel J. (7217 Ottawa Rd. NE., Albuquerque, NM 87109)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- particle-free; microchip; processing; method; apparatus; reducing; particulate; contamination; disclosed; comprise; means; reduce; particle; velocity; wafer; particles; deposited; surface; reactor; electric; fields; prevent; porous; showerhead; velocities; processing method; reduce particle; electric field; electric fields; particulate contamination; wafer surface; apparatus comprise; particle velocity; microchip processing; reducing particulate; particle velocities; /118/
Citation Formats
Geller, Anthony S, and Rader, Daniel J. Particle-free microchip processing. United States: N. p., 1996.
Web.
Geller, Anthony S, & Rader, Daniel J. Particle-free microchip processing. United States.
Geller, Anthony S, and Rader, Daniel J. Mon .
"Particle-free microchip processing". United States. https://www.osti.gov/servlets/purl/870442.
@article{osti_870442,
title = {Particle-free microchip processing},
author = {Geller, Anthony S and Rader, Daniel J},
abstractNote = {Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 1996},
month = {Mon Jan 01 00:00:00 EST 1996}
}
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Works referenced in this record:
Flow Phenomena in Chemical Vapor Deposition of Thin Films
journal, January 1991
- Jensen, Klavs F.; Einset, Erik O.; Fotiadis, Dimitrios I.
- Annual Review of Fluid Mechanics, Vol. 23, Issue 1