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Title: Particle-free microchip processing

Abstract

Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.

Inventors:
 [1];  [2]
  1. 7723 Storrie Pl. NE., Albuquerque, NM 87109
  2. 7217 Ottawa Rd. NE., Albuquerque, NM 87109
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
870442
Patent Number(s):
5522933
Assignee:
Geller, Anthony S. (7723 Storrie Pl. NE., Albuquerque, NM 87109);Rader, Daniel J. (7217 Ottawa Rd. NE., Albuquerque, NM 87109)
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
particle-free; microchip; processing; method; apparatus; reducing; particulate; contamination; disclosed; comprise; means; reduce; particle; velocity; wafer; particles; deposited; surface; reactor; electric; fields; prevent; porous; showerhead; velocities; processing method; reduce particle; electric field; electric fields; particulate contamination; wafer surface; apparatus comprise; particle velocity; microchip processing; reducing particulate; particle velocities; /118/

Citation Formats

Geller, Anthony S, and Rader, Daniel J. Particle-free microchip processing. United States: N. p., 1996. Web.
Geller, Anthony S, & Rader, Daniel J. Particle-free microchip processing. United States.
Geller, Anthony S, and Rader, Daniel J. Mon . "Particle-free microchip processing". United States. https://www.osti.gov/servlets/purl/870442.
@article{osti_870442,
title = {Particle-free microchip processing},
author = {Geller, Anthony S and Rader, Daniel J},
abstractNote = {Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {1}
}

Patent:

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