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Title: SAW determination of surface area of thin films

Abstract

N.sub.2 adsorption isotherms are measured from thin films on SAW devices. The isotherms may be used to determine the surface area and pore size distribution of thin films.

Inventors:
 [1];  [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
867485
Patent Number(s):
4947677
Assignee:
United States of America as represented by United States (Washington, DC) SNL
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
determination; surface; films; adsorption; isotherms; measured; devices; determine; pore; size; distribution; size distribution; pore size; sorption isotherms; /73/

Citation Formats

Frye, Gregory C., Martin, Stephen J., and Ricco, Antonio J. SAW determination of surface area of thin films. United States: N. p., 1990. Web.
Frye, Gregory C., Martin, Stephen J., & Ricco, Antonio J. SAW determination of surface area of thin films. United States.
Frye, Gregory C., Martin, Stephen J., and Ricco, Antonio J. Mon . "SAW determination of surface area of thin films". United States. https://www.osti.gov/servlets/purl/867485.
@article{osti_867485,
title = {SAW determination of surface area of thin films},
author = {Frye, Gregory C. and Martin, Stephen J. and Ricco, Antonio J.},
abstractNote = {N.sub.2 adsorption isotherms are measured from thin films on SAW devices. The isotherms may be used to determine the surface area and pore size distribution of thin films.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1990},
month = {1}
}

Patent:

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