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Title: Apparatus and method for selective area deposition of thin films on electrically biased substrates

Abstract

An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.

Inventors:
 [1];  [2];  [3]
  1. (Oak Ridge, TN)
  2. (Knoxville, TN)
  3. (Le Cheylas, FR)
Issue Date:
Research Org.:
LOCKHEED MARTIN ENRGY SYST INC
OSTI Identifier:
872320
Patent Number(s):
5910220
Assignee:
Martin Marietta Energy Systems, Inc. (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
apparatus; method; selective; deposition; films; electrically; biased; substrates; beam; process; polarized; substrate; potential; applied; allows; ionized; particles; reach; selected; film; left; uncoated; held; repells; potential applied; beam deposition; film deposition; deposition process; electrically biased; polarized substrate; biased substrates; /118/204/

Citation Formats

Zuhr, Raymond A., Haynes, Tony E., and Golanski, Andrzej. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States: N. p., 1999. Web.
Zuhr, Raymond A., Haynes, Tony E., & Golanski, Andrzej. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States.
Zuhr, Raymond A., Haynes, Tony E., and Golanski, Andrzej. Fri . "Apparatus and method for selective area deposition of thin films on electrically biased substrates". United States. https://www.osti.gov/servlets/purl/872320.
@article{osti_872320,
title = {Apparatus and method for selective area deposition of thin films on electrically biased substrates},
author = {Zuhr, Raymond A. and Haynes, Tony E. and Golanski, Andrzej},
abstractNote = {An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

Patent:

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