Apparatus and method for selective area deposition of thin films on electrically biased substrates
Abstract
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.
- Inventors:
-
- Oak Ridge, TN
- Knoxville, TN
- Le Cheylas, FR
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 872320
- Patent Number(s):
- 5910220
- Assignee:
- Martin Marietta Energy Systems, Inc. (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- DOE Contract Number:
- AC05-84OR21400
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- apparatus; method; selective; deposition; films; electrically; biased; substrates; beam; process; polarized; substrate; potential; applied; allows; ionized; particles; reach; selected; film; left; uncoated; held; repells; potential applied; beam deposition; film deposition; deposition process; electrically biased; polarized substrate; biased substrates; /118/204/
Citation Formats
Zuhr, Raymond A, Haynes, Tony E, and Golanski, Andrzej. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States: N. p., 1999.
Web.
Zuhr, Raymond A, Haynes, Tony E, & Golanski, Andrzej. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States.
Zuhr, Raymond A, Haynes, Tony E, and Golanski, Andrzej. Fri .
"Apparatus and method for selective area deposition of thin films on electrically biased substrates". United States. https://www.osti.gov/servlets/purl/872320.
@article{osti_872320,
title = {Apparatus and method for selective area deposition of thin films on electrically biased substrates},
author = {Zuhr, Raymond A and Haynes, Tony E and Golanski, Andrzej},
abstractNote = {An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1999},
month = {Fri Jan 01 00:00:00 EST 1999}
}