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Title: Scanning fluorescent microthermal imaging apparatus and method

Abstract

A scanning fluorescent microthermal imaging (FMI) apparatus and method is disclosed, useful for integrated circuit (IC) failure analysis, that uses a scanned and focused beam from a laser to excite a thin fluorescent film disposed over the surface of the IC. By collecting fluorescent radiation from the film, and performing point-by-point data collection with a single-point photodetector, a thermal map of the IC is formed to measure any localized heating associated with defects in the IC. 1 fig.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
563693
Patent Number(s):
5705821
Application Number:
PAN: 8-743,787
Assignee:
Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 6 Jan 1998
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; THERMOGRAPHY; RELIABILITY; TESTING; LASER RADIATION; FLUORESCENCE; DEFECTS

Citation Formats

Barton, D L, and Tangyunyong, P. Scanning fluorescent microthermal imaging apparatus and method. United States: N. p., 1998. Web.
Barton, D L, & Tangyunyong, P. Scanning fluorescent microthermal imaging apparatus and method. United States.
Barton, D L, and Tangyunyong, P. Tue . "Scanning fluorescent microthermal imaging apparatus and method". United States.
@article{osti_563693,
title = {Scanning fluorescent microthermal imaging apparatus and method},
author = {Barton, D L and Tangyunyong, P},
abstractNote = {A scanning fluorescent microthermal imaging (FMI) apparatus and method is disclosed, useful for integrated circuit (IC) failure analysis, that uses a scanned and focused beam from a laser to excite a thin fluorescent film disposed over the surface of the IC. By collecting fluorescent radiation from the film, and performing point-by-point data collection with a single-point photodetector, a thermal map of the IC is formed to measure any localized heating associated with defects in the IC. 1 fig.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}