Scanning fluorescent microthermal imaging apparatus and method
Abstract
A scanning fluorescent microthermal imaging (FMI) apparatus and method is disclosed, useful for integrated circuit (IC) failure analysis, that uses a scanned and focused beam from a laser to excite a thin fluorescent film disposed over the surface of the IC. By collecting fluorescent radiation from the film, and performing point-by-point data collection with a single-point photodetector, a thermal map of the IC is formed to measure any localized heating associated with defects in the IC. 1 fig.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Org.:
- USDOE, Washington, DC (United States)
- OSTI Identifier:
- 563693
- Patent Number(s):
- 5705821
- Application Number:
- PAN: 8-743,787
- Assignee:
- Sandia Corp., Albuquerque, NM (United States)
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 6 Jan 1998
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; THERMOGRAPHY; RELIABILITY; TESTING; LASER RADIATION; FLUORESCENCE; DEFECTS
Citation Formats
Barton, D L, and Tangyunyong, P. Scanning fluorescent microthermal imaging apparatus and method. United States: N. p., 1998.
Web.
Barton, D L, & Tangyunyong, P. Scanning fluorescent microthermal imaging apparatus and method. United States.
Barton, D L, and Tangyunyong, P. Tue .
"Scanning fluorescent microthermal imaging apparatus and method". United States.
@article{osti_563693,
title = {Scanning fluorescent microthermal imaging apparatus and method},
author = {Barton, D L and Tangyunyong, P},
abstractNote = {A scanning fluorescent microthermal imaging (FMI) apparatus and method is disclosed, useful for integrated circuit (IC) failure analysis, that uses a scanned and focused beam from a laser to excite a thin fluorescent film disposed over the surface of the IC. By collecting fluorescent radiation from the film, and performing point-by-point data collection with a single-point photodetector, a thermal map of the IC is formed to measure any localized heating associated with defects in the IC. 1 fig.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 06 00:00:00 EST 1998},
month = {Tue Jan 06 00:00:00 EST 1998}
}
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