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Title: Dry soldering with hot filament produced atomic hydrogen

A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.
Inventors:
; ;
Issue Date:
OSTI Identifier:
46320
Assignee:
Sandia Corp., Albuquerque, NM (United States) SNL; SCA: 360101; 426000; PA: EDB-95:077482; SN: 95001384529
Patent Number(s):
US 5,409,543/A/
Application Number:
PAN: 7-994,793
Contract Number:
AC04-76DP00789
Resource Relation:
Other Information: PBD: 25 Apr 1995
Research Org:
AT&T Corporation
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; METALS; SURFACE TREATMENTS; SOLDERING; ELECTRONIC CIRCUITS; MANUFACTURING; EQUIPMENT

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