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Title: Dry soldering with hot filament produced atomic hydrogen

Abstract

A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

Inventors:
; ;
Issue Date:
Research Org.:
AT&T Corporation
OSTI Identifier:
46320
Patent Number(s):
5,409,543
Application Number:
PAN: 7-994,793
Assignee:
Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 25 Apr 1995
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; METALS; SURFACE TREATMENTS; SOLDERING; ELECTRONIC CIRCUITS; MANUFACTURING; EQUIPMENT

Citation Formats

Panitz, J K.G., Jellison, J L, and Staley, D J. Dry soldering with hot filament produced atomic hydrogen. United States: N. p., 1995. Web.
Panitz, J K.G., Jellison, J L, & Staley, D J. Dry soldering with hot filament produced atomic hydrogen. United States.
Panitz, J K.G., Jellison, J L, and Staley, D J. Tue . "Dry soldering with hot filament produced atomic hydrogen". United States.
@article{osti_46320,
title = {Dry soldering with hot filament produced atomic hydrogen},
author = {Panitz, J K.G. and Jellison, J L and Staley, D J},
abstractNote = {A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {4}
}