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Title: Dry soldering with hot filament produced atomic hydrogen

Abstract

A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

Inventors:
 [1];  [2];  [3]
  1. Edgewood, NM
  2. Albuquerque, NM
  3. Los Lunas, NM
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
869845
Patent Number(s):
5409543
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
dry; soldering; hot; filament; produced; atomic; hydrogen; chemically; transforming; metal; surface; oxides; especially; exclusively; suitable; preparing; surfaces; solder; reflow; processes; employs; refractory; filaments; grids; thermally; dissociate; molecular; species; pressure; gas; hydrogen-containing; produce; reactive; plasma; reduce; form; volatile; compounds; removed; flow; applicable; manufacture; printed; circuit; boards; semiconductor; chip; lead; attachment; packaging; multichip; modules; retrofitted; existing; treatment; ovens; furnaces; welding; systems; wave; designs; volatile compound; chemically reduce; semiconductor chip; hydrogen-containing gas; forming metal; atomic hydrogen; preparing metal; form volatile; molecular species; circuit board; metal surface; metal surfaces; refractory metal; gas flow; metal oxide; metal oxides; containing gas; printed circuit; hot filament; reactive species; circuit boards; reactive plasma; surface oxides; active species; metal filaments; molecular specie; flow process; dry soldering; chemically transforming; surface oxide; active plasma; /134/219/228/

Citation Formats

Panitz, Janda K. G., Jellison, James L, and Staley, David J. Dry soldering with hot filament produced atomic hydrogen. United States: N. p., 1995. Web.
Panitz, Janda K. G., Jellison, James L, & Staley, David J. Dry soldering with hot filament produced atomic hydrogen. United States.
Panitz, Janda K. G., Jellison, James L, and Staley, David J. Sun . "Dry soldering with hot filament produced atomic hydrogen". United States. https://www.osti.gov/servlets/purl/869845.
@article{osti_869845,
title = {Dry soldering with hot filament produced atomic hydrogen},
author = {Panitz, Janda K. G. and Jellison, James L and Staley, David J},
abstractNote = {A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}

Patent:

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