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Title: Solder extrusion pressure bonding process and bonded products produced thereby

Abstract

Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Inventors:
; ;
Issue Date:
OSTI Identifier:
7274529
Patent Number(s):
5121871 A
Application Number:
PPN: US 7-511684
Assignee:
Dept. of Energy, Washington, DC (United States) SNL; EDB-94-081492
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Patent File Date: 20 Apr 1990
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; METALS; SOLDERING; SOLDERED JOINTS; RELIABILITY; CONTROLLED ATMOSPHERES; TEMPERATURE RANGE 0273-0400 K; ATMOSPHERES; ELEMENTS; FABRICATION; JOINING; JOINTS; TEMPERATURE RANGE; WELDING; 360101* - Metals & Alloys- Preparation & Fabrication

Citation Formats

Beavis, L.C., Karnowsky, M.M., and Yost, F.G. Solder extrusion pressure bonding process and bonded products produced thereby. United States: N. p., 1992. Web.
Beavis, L.C., Karnowsky, M.M., & Yost, F.G. Solder extrusion pressure bonding process and bonded products produced thereby. United States.
Beavis, L.C., Karnowsky, M.M., and Yost, F.G. Tue . "Solder extrusion pressure bonding process and bonded products produced thereby". United States.
@article{osti_7274529,
title = {Solder extrusion pressure bonding process and bonded products produced thereby},
author = {Beavis, L.C. and Karnowsky, M.M. and Yost, F.G.},
abstractNote = {Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {6}
}