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Title: Apparatus and method for facilitating planar delayering of integrated circuit die

Abstract

An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.

Inventors:
;
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
2293838
Patent Number(s):
11810808
Application Number:
16/669,851
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
DOE Contract Number:  
NA0000622
Resource Type:
Patent
Resource Relation:
Patent File Date: 10/31/2019
Country of Publication:
United States
Language:
English

Citation Formats

Trujillo, Joshua Joseph, and Williams, Robert Allen. Apparatus and method for facilitating planar delayering of integrated circuit die. United States: N. p., 2023. Web.
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Trujillo, Joshua Joseph, & Williams, Robert Allen. Apparatus and method for facilitating planar delayering of integrated circuit die. United States.
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Trujillo, Joshua Joseph, and Williams, Robert Allen. Tue . "Apparatus and method for facilitating planar delayering of integrated circuit die". United States. https://www.osti.gov/servlets/purl/2293838.
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@article{osti_2293838,
title = {Apparatus and method for facilitating planar delayering of integrated circuit die},
author = {Trujillo, Joshua Joseph and Williams, Robert Allen},
abstractNote = {An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 07 00:00:00 EST 2023},
month = {Tue Nov 07 00:00:00 EST 2023}
}
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