Conductive heat spreader and heat sink assembly for optical devices
Abstract
Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1805588
- Patent Number(s):
- 10937671
- Application Number:
- 16/358,383
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- DOE Contract Number:
- B621073
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 03/19/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Doany, Fuad Elias, and Schultz, Mark E. Conductive heat spreader and heat sink assembly for optical devices. United States: N. p., 2021.
Web.
Doany, Fuad Elias, & Schultz, Mark E. Conductive heat spreader and heat sink assembly for optical devices. United States.
Doany, Fuad Elias, and Schultz, Mark E. Tue .
"Conductive heat spreader and heat sink assembly for optical devices". United States. https://www.osti.gov/servlets/purl/1805588.
@article{osti_1805588,
title = {Conductive heat spreader and heat sink assembly for optical devices},
author = {Doany, Fuad Elias and Schultz, Mark E.},
abstractNote = {Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {3}
}
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