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Title: Conductive heat spreader and heat sink assembly for optical devices

Abstract

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Inventors:
;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568247
Patent Number(s):
10269592
Application Number:
15/827,562
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
DOE Contract Number:  
B621073
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/30/2017
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Doany, Fuad Elias, and Schultz, Mark. Conductive heat spreader and heat sink assembly for optical devices. United States: N. p., 2019. Web.
Doany, Fuad Elias, & Schultz, Mark. Conductive heat spreader and heat sink assembly for optical devices. United States.
Doany, Fuad Elias, and Schultz, Mark. Tue . "Conductive heat spreader and heat sink assembly for optical devices". United States. https://www.osti.gov/servlets/purl/1568247.
@article{osti_1568247,
title = {Conductive heat spreader and heat sink assembly for optical devices},
author = {Doany, Fuad Elias and Schultz, Mark},
abstractNote = {Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {4}
}

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Works referenced in this record:

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips
patent, May 2010


Illumination apparatus
patent, July 2015


Chip packaging technique
patent, November 2001