Title: Conductive heat spreader and heat sink assembly for optical devices

Abstract

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Inventors:

Doany, Fuad Elias; Schultz, Mark

Issue Date:

2019-04-23

Research Org.:

International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1568247

Patent Number(s):

10269592

Application Number:

15/827,562

Assignee:

International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):

G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Show more

G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS

G02B6/4268 - {Cooling
G02B6/4269 - {with heat sinks or radiation fins}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/486 - {Via connections through the substrate with or without pins}
H01L21/4882 - {Assembly of heatsink parts}
H01L21/67103 - {mainly by conduction}
H01L2224/29007 - Layer connector smaller than the underlying bonding area
H01L2224/291 - with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2224/29109 - Indium [In] as principal constituent
H01L2224/2919 - with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L2224/32245 - the item being metallic
H01L2224/83203 - Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
H01L2224/834 - with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2224/83801 - Soldering or alloying
H01L2224/8385 - using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
H01L23/3107 - {the device being completely enclosed}
H01L23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks {
H01L24/29 - {of an individual layer connector}
H01L24/32 - {of an individual layer connector}
H01L24/49 - {of a plurality of wire connectors}
H01L24/83 - {using a layer connector}
H01L25/0655 - {the devices being arranged next to each other}
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/014 - Solder alloys
H01L2924/12042 - LASER
H01L2924/15159 - Side view

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS

H01R12/722 - {coupling devices mounted on the edge of the printed circuits}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT

H01S5/02469 - {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
H01S5/02476 - {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements}
H01S5/4025 - {Array arrangements, e.g. constituted by discrete laser diodes or laser bar

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K7/20509 - {Cold plates, e.g. multi-component heat spreader, support plates, non closed structures}

Show less

DOE Contract Number:  

B621073

Resource Type:

Patent

Resource Relation:

Patent File Date: 11/30/2017

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING