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  • Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices

Title: Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices

The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
1178275
Assignee:
U.S. Department of Energy (Washington, DC) GFO
Patent Number(s):
9,010,405
Application Number:
13/021,853
Contract Number:
AC36-08GO28308
Resource Relation:
Patent File Date: 2011 Feb 07
Research Org:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING
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Works referenced in this record:

Thermofluid analysis of staggered and inline pin fin heat sinks
conference, January 2000
  • Dvinsky, A.; Bar-Cohen, A.; Strelets, M.
  • ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
  • DOI: 10.1109/ITHERM.2000.866822

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