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Title: Conductive heat spreader and heat sink assembly for optical devices

Abstract

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Inventors:
;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1805588
Patent Number(s):
10937671
Application Number:
16/358,383
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
B621073
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/19/2019
Country of Publication:
United States
Language:
English

Citation Formats

Doany, Fuad Elias, and Schultz, Mark E. Conductive heat spreader and heat sink assembly for optical devices. United States: N. p., 2021. Web.
Doany, Fuad Elias, & Schultz, Mark E. Conductive heat spreader and heat sink assembly for optical devices. United States.
Doany, Fuad Elias, and Schultz, Mark E. Tue . "Conductive heat spreader and heat sink assembly for optical devices". United States. https://www.osti.gov/servlets/purl/1805588.
@article{osti_1805588,
title = {Conductive heat spreader and heat sink assembly for optical devices},
author = {Doany, Fuad Elias and Schultz, Mark E.},
abstractNote = {Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 02 00:00:00 EST 2021},
month = {Tue Mar 02 00:00:00 EST 2021}
}

Works referenced in this record:

Multi-Wavelength Laser Diode Package Arrangement
patent-application, February 2017


Illumination apparatus
patent, July 2015


Optimal Communication Devices Having Optical Time Domain Reflectometers
patent-application, October 2013


LED with light transmissive heat sink
patent-application, April 2007


Free Space Fiber-Optic Connector
patent-application, March 2016


Integrated Thermoelectric Cooling for Silicon Photonics
journal, January 2017


Chip packaging technique
patent, November 2001


Microsystem packaging and associated methods
patent-application, March 2004


High Power Laser Package with Vapor Chamber
patent-application, December 2010