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Title: Assembly of opto-electronic module with improved heat sink

Abstract

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Inventors:
 [1];  [2];  [3];  [4];  [5];  [6];  [7];  [8];  [7]
  1. Vestal, NY
  2. Richelieu, CA
  3. Rochester, MN
  4. Binghampton, NY
  5. Stukely-sud, CA
  6. Yorktown Heights, NY
  7. Granby, CA
  8. Lisle, NY
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
879857
Patent Number(s):
6822875
Application Number:
10/281036
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Chan, Benson, Fortier, Paul Francis, Freitag, Ladd William, Galli, Gary T, Guindon, Francois, Johnson, Glen Walden, Letourneau, Martial, Sherman, John H, and Tetreault, Real. Assembly of opto-electronic module with improved heat sink. United States: N. p., 2004. Web.
Chan, Benson, Fortier, Paul Francis, Freitag, Ladd William, Galli, Gary T, Guindon, Francois, Johnson, Glen Walden, Letourneau, Martial, Sherman, John H, & Tetreault, Real. Assembly of opto-electronic module with improved heat sink. United States.
Chan, Benson, Fortier, Paul Francis, Freitag, Ladd William, Galli, Gary T, Guindon, Francois, Johnson, Glen Walden, Letourneau, Martial, Sherman, John H, and Tetreault, Real. Tue . "Assembly of opto-electronic module with improved heat sink". United States. https://www.osti.gov/servlets/purl/879857.
@article{osti_879857,
title = {Assembly of opto-electronic module with improved heat sink},
author = {Chan, Benson and Fortier, Paul Francis and Freitag, Ladd William and Galli, Gary T and Guindon, Francois and Johnson, Glen Walden and Letourneau, Martial and Sherman, John H and Tetreault, Real},
abstractNote = {A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {11}
}

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Works referenced in this record:

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