Assembly of opto-electronic module with improved heat sink

Chan, Benson; Fortier, Paul Francis; Freitag, Ladd William; Galli, Gary T; Guindon, Francois; Johnson, Glen Walden; Letourneau, Martial; Sherman, John H; Tetreault, Real

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A - human necessities
A01 - agriculture
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Title: Assembly of opto-electronic module with improved heat sink

Abstract

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Inventors:

Chan, Benson ^[1]; Fortier, Paul Francis ^[2]; Freitag, Ladd William ^[3]; Galli, Gary T ^[4]; Guindon, Francois ^[5]; Johnson, Glen Walden ^[6]; Letourneau, Martial ^[7]; Sherman, John H ^[8]; Tetreault, Real ^[7]

Vestal, NY
Richelieu, CA
Rochester, MN
Binghampton, NY
Stukely-sud, CA
Yorktown Heights, NY
Granby, CA
Lisle, NY

Issue Date:: 2004-11-23

Research Org.:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

OSTI Identifier:: 879857

Patent Number(s):: 6822875

Application Number:: 10/281036

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):: G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
G02B6/4201 - {Packages, e.g. shape, construction, internal or external details}
G02B6/421 - {the intermediate optical component consisting of a short length of fibre, e.g. fibre stub}
G02B6/4245 - {Mounting of the opto-electronic elements}
G02B6/4249 - {comprising arrays of active devices and fibres}
G02B6/4253 - {by embedding housing components in an adhesive or a polymer material
G02B6/4255 - {Moulded or casted packages}
G02B6/4269 - {with heat sinks or radiation fins}
G02B6/4277 - {Protection against electromagnetic interference [EMI], e.g. shielding means
G02B6/4281 - {the printed circuit boards being flexible
G02B6/4283 - {with electrical insulation means}
G02B6/4292 - {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2224/32057 - in side view
H01L2224/45144 - Gold
H01L2224/83385 - Shape, e.g. interlocking features
H01L23/3733 - {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
H01L23/3737 - {Organic materials with or without a thermoconductive filler}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01079 - Gold [Au]
H01L2924/3011 - Impedance

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Chan, Benson, Fortier, Paul Francis, Freitag, Ladd William, Galli, Gary T, Guindon, Francois, Johnson, Glen Walden, Letourneau, Martial, Sherman, John H, and Tetreault, Real. Assembly of opto-electronic module with improved heat sink.  United States: N. p., 2004. 
        Web.

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                    Chan, Benson, Fortier, Paul Francis, Freitag, Ladd William, Galli, Gary T, Guindon, Francois, Johnson, Glen Walden, Letourneau, Martial, Sherman, John H, & Tetreault, Real. Assembly of opto-electronic module with improved heat sink.  United States.

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                    Chan, Benson, Fortier, Paul Francis, Freitag, Ladd William, Galli, Gary T, Guindon, Francois, Johnson, Glen Walden, Letourneau, Martial, Sherman, John H, and Tetreault, Real. Tue .  
        "Assembly of opto-electronic module with improved heat sink".  United States.  https://www.osti.gov/servlets/purl/879857.

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@article{osti_879857,

  title        = {Assembly of opto-electronic module with improved heat sink},

  author       = {Chan, Benson and Fortier, Paul Francis and Freitag, Ladd William and Galli, Gary T and Guindon, Francois and Johnson, Glen Walden and Letourneau, Martial and Sherman, John H and Tetreault, Real},

  abstractNote = {A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2004},

  month        = {11}

}

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Works referenced in this record:

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Lebby, M.; Gaw, C. A.; Jiang, Wenbin
1996 Proceedings 46th Electronic Components and Technology Conference
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200-Mb/s/ch 100-m optical subsystem interconnections using 8-channel 1.3-μm laser diode arrays and single-mode fiber arrays
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1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
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Reliable, compact, CMOS interface, 200-Mbit/s a 12-channel optical interconnects using single-mode fiber arrays
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1997 47th Electronic Components and Technology Conference, 1997 Proceedings 47th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1997.606173

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1997 47th Electronic Components and Technology Conference, 1997 Proceedings 47th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1997.606171

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Title: Assembly of opto-electronic module with improved heat sink

Abstract

Citation Formats

Characteristics of VCSEL arrays for parallel optical interconnects conference, May 1996

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools conference, January 1996

200-Mb/s/ch 100-m optical subsystem interconnections using 8-channel 1.3-μm laser diode arrays and single-mode fiber arrays journal, January 1994

The PONI-1 parallel-optical link conference, January 1999

Gigabyte/s data communications with the POLO parallel optical link conference, January 1996

The Jitney Parallel Optical Interconnect conference, May 1996

Packaging for a 40-channel parallel optical interconnection module with an over-25-Gbit/s throughput journal, January 1999

Parallel optical link (PAROLI) for multichannel gigabit rate interconnections conference, January 1998

Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect conference, January 1998

Packaging aspects of the Jitney parallel optical interconnect conference, January 1998

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection conference, January 1996

Reliable, compact, CMOS interface, 200-Mbit/s a 12-channel optical interconnects using single-mode fiber arrays conference, January 1997

3.5 Gb/s×4 ch optical interconnection module for ATM switching system conference, January 1997

Characteristics of VCSEL arrays for parallel optical interconnects
conference, May 1996

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
conference, January 1996

200-Mb/s/ch 100-m optical subsystem interconnections using 8-channel 1.3-μm laser diode arrays and single-mode fiber arrays
journal, January 1994

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conference, January 1999

Gigabyte/s data communications with the POLO parallel optical link
conference, January 1996

The Jitney Parallel Optical Interconnect
conference, May 1996

Packaging for a 40-channel parallel optical interconnection module with an over-25-Gbit/s throughput
journal, January 1999

Parallel optical link (PAROLI) for multichannel gigabit rate interconnections
conference, January 1998

Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect
conference, January 1998

Packaging aspects of the Jitney parallel optical interconnect
conference, January 1998

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
conference, January 1996

Reliable, compact, CMOS interface, 200-Mbit/s a 12-channel optical interconnects using single-mode fiber arrays
conference, January 1997

3.5 Gb/s×4 ch optical interconnection module for ATM switching system
conference, January 1997