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Title: Method and apparatus for power delivery to a die stack via a heat spreader

Abstract

Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip.

Inventors:
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1632416
Patent Number(s):
10529677
Application Number:
15/965,425
Assignee:
Advanced Micro Devices, Inc. (Santa Clara, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC52-07NA27344; B620717
Resource Type:
Patent
Resource Relation:
Patent File Date: 04/27/2018
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Yudanov, Dmitri. Method and apparatus for power delivery to a die stack via a heat spreader. United States: N. p., 2020. Web.
Yudanov, Dmitri. Method and apparatus for power delivery to a die stack via a heat spreader. United States.
Yudanov, Dmitri. Tue . "Method and apparatus for power delivery to a die stack via a heat spreader". United States. https://www.osti.gov/servlets/purl/1632416.
@article{osti_1632416,
title = {Method and apparatus for power delivery to a die stack via a heat spreader},
author = {Yudanov, Dmitri},
abstractNote = {Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {1}
}

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Works referenced in this record:

Methods for assembling multiple semiconductor devices
patent, April 2007