Method and apparatus for power delivery to a die stack via a heat spreader
Abstract
Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1632416
- Patent Number(s):
- 10529677
- Application Number:
- 15/965,425
- Assignee:
- Advanced Micro Devices, Inc. (Santa Clara, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC52-07NA27344; B620717
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 04/27/2018
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Yudanov, Dmitri. Method and apparatus for power delivery to a die stack via a heat spreader. United States: N. p., 2020.
Web.
Yudanov, Dmitri. Method and apparatus for power delivery to a die stack via a heat spreader. United States.
Yudanov, Dmitri. Tue .
"Method and apparatus for power delivery to a die stack via a heat spreader". United States. https://www.osti.gov/servlets/purl/1632416.
@article{osti_1632416,
title = {Method and apparatus for power delivery to a die stack via a heat spreader},
author = {Yudanov, Dmitri},
abstractNote = {Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {1}
}