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Title: Lubricated mechanical polishing

Abstract

A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.

Inventors:
;
Issue Date:
Research Org.:
Ames Lab., Ames, IA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600143
Patent Number(s):
10442055
Application Number:
15/530,575
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Classifications (CPCs):
C - CHEMISTRY C10 - PETROLEUM, GAS OR COKE INDUSTRIES C10N - INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
C - CHEMISTRY C09 - DYES C09K - MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
DOE Contract Number:  
AC02-07CH11358
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/31/2017
Country of Publication:
United States
Language:
English

Citation Formats

Cademartiri, Ludovico, and Montoya, Briane Caroline. Lubricated mechanical polishing. United States: N. p., 2019. Web.
Cademartiri, Ludovico, & Montoya, Briane Caroline. Lubricated mechanical polishing. United States.
Cademartiri, Ludovico, and Montoya, Briane Caroline. Tue . "Lubricated mechanical polishing". United States. https://www.osti.gov/servlets/purl/1600143.
@article{osti_1600143,
title = {Lubricated mechanical polishing},
author = {Cademartiri, Ludovico and Montoya, Briane Caroline},
abstractNote = {A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}

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Works referenced in this record:

Slurry composition and method of chemical mechanical polishing using same
patent, June 2001


Method for texturing a metallic thin film
patent, December 1996


Free abrasive slurry composition and a grinding method using the same
patent, May 2002


Methods, apparatus and slurries for chemical mechanical planarization
patent, September 2003


Polishing compound and method for polishing substrate
patent, September 2004