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Title: Lubricated mechanical polishing

Abstract

A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.

Inventors:
;
Issue Date:
Research Org.:
Ames Laboratory (AMES), Ames, IA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600143
Patent Number(s):
10442055
Application Number:
15/530,575
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
C - CHEMISTRY C09 - DYES C09K - MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
DOE Contract Number:  
AC02-07CH11358
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/31/2017
Country of Publication:
United States
Language:
English

Citation Formats

Cademartiri, Ludovico, and Montoya, Briane Caroline. Lubricated mechanical polishing. United States: N. p., 2019. Web.
Cademartiri, Ludovico, & Montoya, Briane Caroline. Lubricated mechanical polishing. United States.
Cademartiri, Ludovico, and Montoya, Briane Caroline. Tue . "Lubricated mechanical polishing". United States. https://www.osti.gov/servlets/purl/1600143.
@article{osti_1600143,
title = {Lubricated mechanical polishing},
author = {Cademartiri, Ludovico and Montoya, Briane Caroline},
abstractNote = {A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 15 00:00:00 EDT 2019},
month = {Tue Oct 15 00:00:00 EDT 2019}
}

Works referenced in this record:

Polishing Fluid and Polishing Method
patent-application, March 2005


Free abrasive slurry composition and a grinding method using the same
patent, May 2002


Slurry for Chemical Mechanical Polishing
patent-application, June 2001


Process for Preparing Metal Oxide Slurry Suitable for Semiconductor Chemical Mechanical Polishing
patent-application, November 2001


Abrasive Article and Methods for Grinding Glass
patent-application, September 2003


Array of Abrasive Members with Resilient Support
patent-application, November 2010


Method for texturing a metallic thin film
patent, December 1996


Methods, apparatus and slurries for chemical mechanical planarization
patent, September 2003


Slurry composition and method of chemical mechanical polishing using same
patent, June 2001


Polishing compound and method for polishing substrate
patent, September 2004