Use of chemical mechanical polishing in micromachining

Nasby, Robert D; Hetherington, Dale L; Sniegowski, Jeffry J; McWhorter, Paul J; Apblett, Christopher A

Title: Use of chemical mechanical polishing in micromachining

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Abstract

A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.

Inventors:

Nasby, Robert D ^[1]; Hetherington, Dale L ^[1]; Sniegowski, Jeffry J ^[1]; McWhorter, Paul J ^[1]; Apblett, Christopher A ^[2]

Albuquerque, NM
Cedar Crest, NM

Issue Date:: 1998-01-01

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

OSTI Identifier:: 871820

Patent Number(s):: 5804084

Assignee:: Sandia Corporation (Albuquerque, NM)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

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B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
B81C1/00611 - {Processes for the planarisation of structures
B81C2201/0125 - Blanket removal, e.g. polishing

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: chemical; mechanical; polishing; micromachining; process; removing; topography; effects; fabrication; micromachines; sacrificial; oxide; layer; deposited; level; containing; functional; elements; etched; valleys; sufficient; thickness; fill; extend; upwards; extent; lowest; upper; surface; top; covered; polished; planarized; chemical-mechanical; formed; chemical-mechanical polishing; sufficient thickness; top surface; upper surface; oxide layer; sacrificial oxide; functional elements; mechanical polishing; sacrificial layer; /216/438/

Citation Formats


                    Nasby, Robert D, Hetherington, Dale L, Sniegowski, Jeffry J, McWhorter, Paul J, and Apblett, Christopher A. Use of chemical mechanical polishing in micromachining.  United States: N. p., 1998. 
        Web.

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                    Nasby, Robert D, Hetherington, Dale L, Sniegowski, Jeffry J, McWhorter, Paul J, & Apblett, Christopher A. Use of chemical mechanical polishing in micromachining.  United States.

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                    Nasby, Robert D, Hetherington, Dale L, Sniegowski, Jeffry J, McWhorter, Paul J, and Apblett, Christopher A. Thu .  
        "Use of chemical mechanical polishing in micromachining".  United States.  https://www.osti.gov/servlets/purl/871820.

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@article{osti_871820,

  title        = {Use of chemical mechanical polishing in micromachining},

  author       = {Nasby, Robert D and Hetherington, Dale L and Sniegowski, Jeffry J and McWhorter, Paul J and Apblett, Christopher A},

  abstractNote = {A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1998},

  month        = {1}

}

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