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Title: Apparatus and method for deterministic control of surface figure during full aperture pad polishing

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.
Inventors:
; ;
Issue Date:
OSTI Identifier:
1398989
Assignee:
Lawrence Livermore National Security, LLC LLNL
Patent Number(s):
9,782,871
Application Number:
14/055,780
Contract Number:
AC52-07N27344
Resource Relation:
Patent File Date: 2013 Oct 16
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Other works cited in this record:

Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
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Extended Life Conditioning Disk
patent-application, December 2007

Pad Conditioner for Chemical Mechanical Polishing
patent-application, April 2009

Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same
patent-application, October 2009

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