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Title: Apparatus and method for deterministic control of surface figure during full aperture pad polishing

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.
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Issue Date:
OSTI Identifier:
Lawrence Livermore National Security, LLC LLNL
Patent Number(s):
Application Number:
Contract Number:
Resource Relation:
Patent File Date: 2013 Oct 16
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org:
Country of Publication:
United States

Other works cited in this record:

Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
patent, July 1996

Dressing apparatus and method
patent, July 1997

Polishing device and correcting method therefor
patent, October 1997

Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
patent, May 1998

Apparatus for and method for polishing workpiece
patent, June 1998

Dual purpose retaining ring and polishing pad conditioner
patent, December 1999

Dual element lapping guide system
patent, February 2000

Automatic lapping method of a thin film element and a lapping apparatus using the same
patent, October 2000

Chemical mechanical polishing apparatus with improved substrate carrier head and method of use
patent, October 2000

Dressing apparatus for chemical mechanical polishing pad
patent, March 2001

Retaining ring for chemical mechanical polishing
patent, May 2001

Method for controlling machining process of workpiece
patent, December 2001

Optical monitoring in a two-step chemical mechanical polishing process
patent, January 2003

Optical monitoring in a two-step chemical mechanical polishing process
patent, October 2003

Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing
patent, March 2004

Method and apparatus for conditioning fixed-abrasive polishing pads
patent, June 2004

CMP in-situ conditioning with pad and retaining ring clean
patent, October 2004

Retaining ring for use in chemical mechanical polishing
patent, November 2004

Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
patent, May 2005

Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
patent, July 2006

Polishing apparatus
patent-application, November 2001

Wafer carrier used for chemical mechanic polishing
patent-application, April 2003

Retaining ring having reduced wear and contamination rate for a polishing head of a CMP tool
patent-application, July 2004

Polishing apparatus and polishing method
patent-application, September 2004

Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
patent-application, December 2004

Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
patent-application, January 2006

Retaining Ring Structure for Enhanced Removal Rate During Fixed Abrasive Chemical Mechanical Polishing
patent-application, March 2007

Extended Life Conditioning Disk
patent-application, December 2007

Pad Conditioner for Chemical Mechanical Polishing
patent-application, April 2009

Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same
patent-application, October 2009

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