Chemical-mechanical polishing of recessed microelectromechanical devices

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872368

Barron, Carole C ^[1]; Hetherington, Dale L ^[1]; Montague, Stephen ^[1]

---

1. Albuquerque, NM

A method is disclosed for micromachining recessed layers (e.g. sacrificial layers) of a microelectromechanical system (MEMS) device formed in a cavity etched into a semiconductor substrate. The method uses chemical-mechanical polishing (CMP) with a resilient polishing pad to locally planarize one or more of the recessed layers within the substrate cavity. Such local planarization using the method of the present invention is advantageous for improving the patterning of subsequently deposited layers, for eliminating mechanical interferences between functional elements (e.g. linkages) of the MEMS device, and for eliminating the formation of stringers. After the local planarization of one or more of the recessed layers, another CMP step can be provided for globally planarizing the semiconductor substrate to form a recessed MEMS device which can be integrated with electronic circuitry (e.g. CMOS, BiCMOS or bipolar circuitry) formed on the surface of the substrate.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5919548
• OSTI ID: 872368
• Country of Publication: United States
• Language: English

Related Subjects

chemical-mechanical
polishing
recessed
microelectromechanical
devices
method
disclosed
micromachining
layers
sacrificial
mems
device
formed
cavity
etched
semiconductor
substrate
cmp
resilient
pad
locally
planarize
local
planarization
advantageous
improving
patterning
subsequently
deposited
eliminating
mechanical
interferences
functional
elements
linkages
formation
stringers
step
provided
globally
planarizing
form
integrated
electronic
circuitry
cmos
bicmos
bipolar
surface
chemical-mechanical polishing
microelectromechanical devices
electronic circuit
semiconductor substrate
electronic circuitry
mems device
subsequently deposited
mechanical device
functional elements
device formed
sacrificial layers
cavity etched
mechanical polishing
deposited layer
electromechanical devices
mechanical devices
sacrificial layer
microelectromechanical device
subsequently deposit
/428/438/