DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Apparatus and method for deterministic control of surface figure during full aperture polishing

Abstract

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.

Inventors:
; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1108608
Patent Number(s):
8588956
Application Number:
12/695,986
Assignee:
LLNL
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Suratwala, Tayyab Ishaq, Feit, Michael Dennis, and Steele, William Augustus. Apparatus and method for deterministic control of surface figure during full aperture polishing. United States: N. p., 2013. Web.
Suratwala, Tayyab Ishaq, Feit, Michael Dennis, & Steele, William Augustus. Apparatus and method for deterministic control of surface figure during full aperture polishing. United States.
Suratwala, Tayyab Ishaq, Feit, Michael Dennis, and Steele, William Augustus. Tue . "Apparatus and method for deterministic control of surface figure during full aperture polishing". United States. https://www.osti.gov/servlets/purl/1108608.
@article{osti_1108608,
title = {Apparatus and method for deterministic control of surface figure during full aperture polishing},
author = {Suratwala, Tayyab Ishaq and Feit, Michael Dennis and Steele, William Augustus},
abstractNote = {A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {11}
}

Works referenced in this record:

Pad Conditioner for Chemical Mechanical Polishing
patent-application, April 2009


Optical monitoring in a two-step chemical mechanical polishing process
patent, October 2003


Polishing apparatus
patent-application, November 2001


Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
patent-application, January 2006


Extended Life Conditioning Disk
patent-application, December 2007


Automatic lapping method of a thin film element and a lapping apparatus using the same
patent, October 2000


Optical monitoring in a two-step chemical mechanical polishing process
patent, January 2003


Apparatus for and method for polishing workpiece
patent, June 1998


Method for controlling machining process of workpiece
patent, December 2001


Dual element lapping guide system
patent, February 2000