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Title: Apparatus and method for deterministic control of surface figure during full aperture polishing

Abstract

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.

Inventors:
; ;
Issue Date:
Research Org.:
LLNL (Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States))
Sponsoring Org.:
USDOE
OSTI Identifier:
1108608
Patent Number(s):
8,588,956
Application Number:
12/695,986
Assignee:
LLNL
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Suratwala, Tayyab Ishaq, Feit, Michael Dennis, and Steele, William Augustus. Apparatus and method for deterministic control of surface figure during full aperture polishing. United States: N. p., 2013. Web.
Suratwala, Tayyab Ishaq, Feit, Michael Dennis, & Steele, William Augustus. Apparatus and method for deterministic control of surface figure during full aperture polishing. United States.
Suratwala, Tayyab Ishaq, Feit, Michael Dennis, and Steele, William Augustus. Tue . "Apparatus and method for deterministic control of surface figure during full aperture polishing". United States. https://www.osti.gov/servlets/purl/1108608.
@article{osti_1108608,
title = {Apparatus and method for deterministic control of surface figure during full aperture polishing},
author = {Suratwala, Tayyab Ishaq and Feit, Michael Dennis and Steele, William Augustus},
abstractNote = {A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {11}
}

Patent:

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