Fast process flow, on-wafer interconnection and singulation for MEPV
Abstract
A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1341870
- Patent Number(s):
- 9559219
- Application Number:
- 14/745,251
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Jun 19
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Okandan, Murat, Nielson, Gregory N., Cruz-Campa, Jose Luis, and Sanchez, Carlos Anthony. Fast process flow, on-wafer interconnection and singulation for MEPV. United States: N. p., 2017.
Web.
Okandan, Murat, Nielson, Gregory N., Cruz-Campa, Jose Luis, & Sanchez, Carlos Anthony. Fast process flow, on-wafer interconnection and singulation for MEPV. United States.
Okandan, Murat, Nielson, Gregory N., Cruz-Campa, Jose Luis, and Sanchez, Carlos Anthony. Tue .
"Fast process flow, on-wafer interconnection and singulation for MEPV". United States. https://www.osti.gov/servlets/purl/1341870.
@article{osti_1341870,
title = {Fast process flow, on-wafer interconnection and singulation for MEPV},
author = {Okandan, Murat and Nielson, Gregory N. and Cruz-Campa, Jose Luis and Sanchez, Carlos Anthony},
abstractNote = {A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {1}
}