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Title: Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages

Abstract

A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.

Inventors:
 [1];  [2];  [3];  [4];  [5]
  1. Katonah, NY
  2. Chestnut Ridge, NY
  3. Yorktown Heights, NY
  4. Pleasantville, NY
  5. Mount Kisco, NY
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1034161
Patent Number(s):
8081473
Application Number:
12/185,520
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
DOE Contract Number:  
B554331
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Cipolla, Thomas M, Colgan, Evan George, Coteus, Paul W, Hall, Shawn Anthony, and Tian, Shurong. Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages. United States: N. p., 2011. Web.
Cipolla, Thomas M, Colgan, Evan George, Coteus, Paul W, Hall, Shawn Anthony, & Tian, Shurong. Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages. United States.
Cipolla, Thomas M, Colgan, Evan George, Coteus, Paul W, Hall, Shawn Anthony, and Tian, Shurong. Tue . "Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages". United States. https://www.osti.gov/servlets/purl/1034161.
@article{osti_1034161,
title = {Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages},
author = {Cipolla, Thomas M and Colgan, Evan George and Coteus, Paul W and Hall, Shawn Anthony and Tian, Shurong},
abstractNote = {A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {12}
}

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