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Title: Device-packaging method and apparatus for optoelectronic circuits

An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.
Inventors:
; ;
Issue Date:
OSTI Identifier:
1353067
Assignee:
Sandia Corporation SNL-A
Patent Number(s):
9,632,261
Application Number:
14/819,293
Contract Number:
AC04-94AL85000
Resource Relation:
Patent File Date: 2015 Aug 05
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS

Works referenced in this record:

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conference, May 2005
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