Device-packaging method and apparatus for optoelectronic circuits
Abstract
An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1353067
- Patent Number(s):
- 9632261
- Application Number:
- 14/819,293
- Assignee:
- Sandia Corporation
- Patent Classifications (CPCs):
-
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Aug 05
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS
Citation Formats
Zortman, William A., Henry, Michael David, and Jarecki, Jr., Robert L. Device-packaging method and apparatus for optoelectronic circuits. United States: N. p., 2017.
Web.
Zortman, William A., Henry, Michael David, & Jarecki, Jr., Robert L. Device-packaging method and apparatus for optoelectronic circuits. United States.
Zortman, William A., Henry, Michael David, and Jarecki, Jr., Robert L. Tue .
"Device-packaging method and apparatus for optoelectronic circuits". United States. https://www.osti.gov/servlets/purl/1353067.
@article{osti_1353067,
title = {Device-packaging method and apparatus for optoelectronic circuits},
author = {Zortman, William A. and Henry, Michael David and Jarecki, Jr., Robert L.},
abstractNote = {An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {4}
}
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