Local, submicron, strain gradients as the cause of Sn whisker growth

Journal Article · Thu Jan 01 00:00:00 EST 2009 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.3147864· OSTI ID:958988

Sobiech, M. ^[1]; Wohlschlogel, M. ^[1]; Welzel, U. ^[1]; Mittemeijer, E. J. ^[1]; Hugel, W. ^[2]; Seekamp, A. ^[2]; Liu, W. ^[3]; Ice, Gene E ^[4]

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1. Max-Planck-Institute for Metals Research, Stuttgart, Germany
2. Robert Bosch GmbH, Reutlingen, Germany
3. Argonne National Laboratory (ANL)
4. ORNL

It has been shown experimentally that local in-plane residual strain gradients occur around the root of spontaneously growing Sn whiskers on the surface of Sn coatings deposited on Cu. The strain distribution has been determined with synchrotron white beam micro Laue diffraction measurements. The observed in-plane residual strain gradients in combination with recently revealed out-of-plane residual strain-depth gradients provide the driving forces for whisker growth.

• Research Organization: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
• Sponsoring Organization: USDOE Office of Science (SC)
• DOE Contract Number: DE-AC05-00OR22725
• OSTI ID: 958988
• Journal Information: Applied Physics Letters, Vol. 94, Issue 22; ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
43 PARTICLE ACCELERATORS
COATINGS
COPPER
CRYSTAL GROWTH
DEPOSITION
DIFFRACTION
DISTRIBUTION
STRAINS
SYNCHROTRONS
WHISKERS
TIN