$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

Pei, Fei; Jadhav, Nitin; Buchovecky, Eric; Bower, Allan F.; Chason, Eric; Liu, Wenjun; Tischler, Jonathan Z.; Ice, Gene E.; Xu, Ruqing

doi:10.1063/1.4942920

$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

Journal Article · Wed Mar 09 00:00:00 EST 2016 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.4942920· OSTI ID:1413990

Pei, Fei ^[1]; Jadhav, Nitin ^[2]; Buchovecky, Eric ^[3]; Bower, Allan F. ^[1]; Chason, Eric ^[1]; Liu, Wenjun ^[4]; Tischler, Jonathan Z. ^[4]; Ice, Gene E. ^[5]; ^[4]

Brown Univ., Providence, RI (United States)
International Business Machines (IBM), Hopewell Junction, NY (United States)
Northboro R&D Center, MA (United States)
Argonne National Lab. (ANL), Argonne, IL (United States). Advanced Photon Source (APS)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

We have performed X-ray synchrotron micro-diffraction measurements to study the processes controlling the formation of hillocks and whiskers in Sn layers on Cu. The studies were done in real-time on Sn layers that were electro-deposited immediately before the X-ray measurements were started. This enabled a region of the sample to be monitored from the as-deposited state until after a hillock feature formed. In addition to measuring the grain orientation and deviatoric strain (via Laue diffraction), the X-ray fluorescence was monitored to quantify the evolution of the Sn surface morphology and the formation of intermetallic compound (IMC) at the Sn-Cu interface. The results capture the simultaneous growth of the feature and the corresponding film stress, grain orientation, and IMC formation. The observations are compared with proposed mechanisms for whisker/hillock growth and nucleation.

View Accepted Manuscript (DOE)

Research Organization:: Argonne National Laboratory (ANL), Argonne, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)

Grant/Contract Number:: AC02-06CH11357

OSTI ID:: 1413990

Alternate ID(s):: OSTI ID: 1241406
OSTI ID: 22596885

Journal Information:: Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 10 Vol. 119; ISSN JAPIAU; ISSN 0021-8979

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

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