Oxygen Implant Isolation of n-GaN Field-Effect Transistor Structures
Journal Article
·
· Journal of Vacuum Science Technology B
- Sandia National Laboratories
Multiple-energy (30-325 keV) O{sup +} implantation into GaN field-effect transistor structures (n {approximately} 10{sup 18} cm{sup {minus}3}, 3000 {angstrom} thick) can produce as-implanted sheet resistances of 4 x 10{sup 12} {Omega}/{open_square}, provided care is taken to ensure compensation of the region up to the projected range of the lowest energy implant. The sheet resistance remains above 10{sup 7} {Omega}/{open_square} to annealing temperatures of {approximately} 650 C and displays an activation energy of 0.29 eV. No diffusion of the implanted oxygen was observed for anneals up to 800 C.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 9476
- Report Number(s):
- SAND99-1914J
- Journal Information:
- Journal of Vacuum Science Technology B, Journal Name: Journal of Vacuum Science Technology B
- Country of Publication:
- United States
- Language:
- English
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