Orientation Dependence of Linewidth Variation in sub-50-nm Gaussian e-beam Lithography and its Correction
Journal Article
·
· Journal of Vacuum Sci. and Tech. B: Microelect. and Nanometer Structure
The width of tilted line patterns, such as are needed when drawing circular structures, is found to vary with the oblique angle when it falls into the sub-50-nm scale in Gaussian e-beam lithography. The authors analysis shows that this orientation dependence of linewidth variation originates from the nonuniformity of discrete primitive filling in Cartesian coordinates. Two correction schemes based on pattern segmentation are proposed. Test exposures of high resolution zone plate patterns show that both two schemes work well; a double-insert scheme is superior in terms of dose distribution uniformity.
- Research Organization:
- Brookhaven National Laboratory (BNL) National Synchrotron Light Source
- Sponsoring Organization:
- Doe - Office Of Science
- DOE Contract Number:
- AC02-98CH10886
- OSTI ID:
- 930582
- Report Number(s):
- BNL--80794-2008-JA
- Journal Information:
- Journal of Vacuum Sci. and Tech. B: Microelect. and Nanometer Structure, Journal Name: Journal of Vacuum Sci. and Tech. B: Microelect. and Nanometer Structure Journal Issue: 6 Vol. 24; ISSN JVTBD9; ISSN 0734-211X
- Country of Publication:
- United States
- Language:
- English
Similar Records
Efficient E-Beam Lithography Exposure Strategies for Diffractive X-ray Optics
Static contrast enhancement layer lithography
Wavelength dependence of the resist sidewall angle in extreme ultraviolet lithography
Journal Article
·
Fri Sep 09 00:00:00 EDT 2011
· AIP Conference Proceedings
·
OSTI ID:21608316
Static contrast enhancement layer lithography
Conference
·
Thu Dec 31 23:00:00 EST 1987
·
OSTI ID:6474108
Wavelength dependence of the resist sidewall angle in extreme ultraviolet lithography
Journal Article
·
Mon Oct 31 23:00:00 EST 1994
· Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)
·
OSTI ID:7094682