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Microelectromechanical systems contact stress sensor

Patent ·
OSTI ID:921497
A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.
Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA
Sponsoring Organization:
United States Department of Energy
DOE Contract Number:
W-7405-ENG-48
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Number(s):
7,311,009
Application Number:
11/143,543
OSTI ID:
921497
Country of Publication:
United States
Language:
English

References (7)

Development of a new contact-type piezoresistive micro-shear-stress sensor
  • Hsieh, M. C.; Fang, Yean-Kuen; Ju, M. S.
  • Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, SPIE Proceedings https://doi.org/10.1117/12.462822
conference April 2002
A flexible MEMS technology and its first application to shear stress sensor skin
  • No authors listed
  • Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots https://doi.org/10.1109/MEMSYS.1997.581894
conference January 1997
New tactile sensor chip with silicone rubber cover journal September 2000
A miniature piezoelectric polymer transducer for in vitro measurement of the dynamic contact stress distribution journal June 1992
Review Article Tactile sensing for mechatronics—a state of the art survey journal February 1999
Flexible miniature ribbon cables for long-term connection to implantable sensors journal April 1990
Silicon ribbon cables for chronically implantable microelectrode arrays journal April 1994

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