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Title: Contact stress sensor

Abstract

A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.

Inventors:
 [1]
  1. Oakland, CA
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1037764
Patent Number(s):
8,109,149
Application Number:
12/274,253
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Kotovsky, Jack. Contact stress sensor. United States: N. p., 2012. Web.
Kotovsky, Jack. Contact stress sensor. United States.
Kotovsky, Jack. Tue . "Contact stress sensor". United States. https://www.osti.gov/servlets/purl/1037764.
@article{osti_1037764,
title = {Contact stress sensor},
author = {Kotovsky, Jack},
abstractNote = {A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {2}
}

Patent:

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