Method of fabricating a microelectronic device package with an integral window

Patent · Tue Dec 31 23:00:00 EST 2002

OSTI ID:875100

Peterson, Kenneth A ^[1]; Watson, Robert D ^[2]

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1. Albuquerque, NM
2. Tijeras, NM

A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

• Research Organization: SANDIA CORP
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6531341
• OSTI ID: 875100
• Country of Publication: United States
• Language: English

Related Subjects

/438/257/
access
accessible
aperture
attached
baking
bonded
ceramic
ceramic layer
cofired
compact
cover
densified
device
electronic device
fabricating
finally
firing
flip-chip
green
hermetically-sealed
high-temperature
htcc
in-between
inserted
insulating
integral
layers
lid
light-sensitive
low-profile
low-temperature
ltcc
material
metallized
method
microelectronic
multilayered
opposite
optical
optical access
optically
package
personalized
providing
registration
result
simultaneously
sintered
stackup
tape
thick-film
traces
window