Sealed symmetric multilayered microelectronic device package with integral windows

Patent · Mon Dec 31 23:00:00 EST 2001

OSTI ID:874922

Peterson, Kenneth A ^[1]; Watson, Robert D ^[2]

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1. Albuquerque, NM
2. Tijeras, NM

A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.

• Research Organization: SANDIA CORP
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6489670
• OSTI ID: 874922
• Country of Publication: United States
• Language: English

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