Bi-level multilayered microelectronic device package with an integral window

Patent · 31 December 2001

OSTI ID:874949

Peterson, Kenneth A ^[1]; Watson, Robert D ^[2]

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1. Albuquerque, NM
2. Tijeras, NM

A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

• Research Organization: SANDIA CORP
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6495895
• OSTI ID: 874949
• Country of Publication: United States
• Language: English

Related Subjects

/257/
accessible
backside
bi-level
bonded
ccd
ceramic
chip
cmos
cofired
compact
device
diode
electronic device
flip-chip
formed
hermetically-sealed
high-temperature
housing
htcc
imems
integral
joined
laser
laser diode
level
light-sensitive
low-profile
low-temperature
ltcc
mems
mems device
microelectronic
multilayer
multilayered
optically
oriented
package
processes
processing
result
semiconductor
semiconductor chip
simultaneously
vcsel
window
wirebonded