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Title: Multilayered Microelectronic Device Package With An Integral Window

Abstract

A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

Inventors:
 [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
Publication Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
880005
Patent Number(s):
US 6,809,413
Application Number:
10/422418
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Peterson, Kenneth A, and Watson, Robert D. Multilayered Microelectronic Device Package With An Integral Window. United States: N. p., 2004. Web.
Peterson, Kenneth A, & Watson, Robert D. Multilayered Microelectronic Device Package With An Integral Window. United States.
Peterson, Kenneth A, and Watson, Robert D. 2004. "Multilayered Microelectronic Device Package With An Integral Window". United States. https://www.osti.gov/servlets/purl/880005.
@article{osti_880005,
title = {Multilayered Microelectronic Device Package With An Integral Window},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.},
doi = {},
url = {https://www.osti.gov/biblio/880005}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {10}
}