Multilayered Microelectronic Device Package With An Integral Window
- Albuquerque, NM
- Tijeras, NM
A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.
- Research Organization:
- Sandia Corporation
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 6,809,413
- Application Number:
- 10/422418
- OSTI ID:
- 880005
- Country of Publication:
- United States
- Language:
- English
Similar Records
Bi-level multilayered microelectronic device package with an integral window
Bi-level microelectronic device package with an integral window