Method of fabricating a microelectronic device package with an integral window

Patent · Wed Jan 01 00:00:00 EST 2003

OSTI ID:875100

Peterson, Kenneth A ^[1]; Watson, Robert D ^[2]

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1. Albuquerque, NM
2. Tijeras, NM

A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6531341
• OSTI ID: 875100
• Country of Publication: United States
• Language: English

Related Subjects

method
fabricating
microelectronic
device
package
integral
window
providing
optical
access
aperture
multilayered
insulating
material
low-temperature
cofired
ceramic
ltcc
high-temperature
htcc
inserted
in-between
personalized
layers
green
tape
stackup
registration
baking
firing
simultaneously
bonded
sintered
densified
flip-chip
thick-film
metallized
traces
light-sensitive
optically
accessible
finally
cover
lid
attached
opposite
result
compact
low-profile
hermetically-sealed
ceramic layer
optical access
electronic device
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