Solar cell array interconnects

Patent · Sat Dec 31 23:00:00 EST 1994

OSTI ID:870154

Carey, Paul G ^[1]; Thompson, Jesse B ^[2]; Colella, Nicolas J ^[3]; Williams, Kenneth A ^[3]

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1. Mountain View, CA
2. Brentwood, CA
3. Livermore, CA

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA
• DOE Contract Number: W-7405-ENG-48
• Assignee: Regents of University of California (Oakland, CA)
• Patent Number(s): US 5466302
• OSTI ID: 870154
• Country of Publication: United States
• Language: English

Related Subjects

/136/228/438/
active
active surface
active surfaces
array
breakage
cell
cell array
cells
components
conductive
conductive paste
contact
contact resistance
conventional
copper
cream
current
current testing
degradation
developed
electrical
electrical interconnect
electrical interconnects
electronic
electronic components
eliminated
eliminates
employs
fluxless
interconnect
interconnects
lead-tin
mil
mil thick
no-clean
paste
pb-sn
providing
residue
resistance
resistance value
secured
shown
silver-silicone
solar
solar cell
solar cells
solder
strips
surfaces
temperature
testing
thick
undesired
value
whereby