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Title: Development of metallization process. Final report

Technical Report ·
DOI:https://doi.org/10.2172/5750094· OSTI ID:5750094

The object of this contract was the optimization, evaluation, and demonstration of a novel metallization applied by a screen printing process. A paste consisting of molybdenum, tin, and titanium hydride was selected as the promising composition. No satisfactory cells were made using any of the molybdenum/tin pastes used as a complete replacement for conventional silver pastes. The major problem is the inability to form a bond between the pastes and silicon that withstands soldering. This problem can be overcome using a two step process where any interconnection to the cell is done at small pads of conventional screen printed silver. The most promising use of the molybdenum/tin metallization system would be this two step process with a silver paste serving as the soldering pad. The Mo/Sn system would compete with silver economically if silver prices rose and could serve as a backup process. Toward the end of this contract the use of a heated stage SEM with reactive gases was a great help in elucidating problems and suggesting solutions.

Research Organization:
Spectrolab, Inc., Sylmar, CA (USA)
DOE Contract Number:
NAS-7-100-956205
OSTI ID:
5750094
Report Number(s):
DOE/JPL/956205-85/8; DRL-175; ON: DE85013585
Country of Publication:
United States
Language:
English